APPLICATION OF CHIPS DESIGNED FOR PARTICLEBOARD CORE IN OSB AS SUBSTITUTE FOR FLAKES
Radosław Mirski, Dorota Dziurka
The aim of the study was to assess the applicability of flake substitution in the core of OSB with chips designed for the core in particleboards. OSB panels were manufactured under laboratory conditions, containing small chips in the core from 0% to 100% of mass fraction (0%, 25%, 50%, 75% 100%) resinated with two types of commonly used binding agents, i.e. MUPF and pMDI resins. It was found that the applied modification of the core structure significantly diminished bending strength and modulus of elasticity; however, even at a 100% fraction of small chips in the core the application of pMDI made it possible to manufacture boards meeting the requirements imposed on OSB/3.